SMT PCBA process capabilities
We also provide PCBA patch processing solutions. In terms of SMT process technology, we support leaded, low-temperature lead-free, high-temperature lead-free, and red glue processes. We can mount PCBs with sizes from 20mm*20mm to 420mm*500mm. The minimum package component is 0201. Supports the placement of BGA, PQFP, PLCC, SOP, SOJ and other integrated circuits. Fuji high-speed chip placement machines, multi-function machines, AOI optical detectors,
eight-temperature zone reflow soldering, wave soldering and other equipment support production capacity realization and process quality. For each PCBA, we check everything from the printing steel mesh to the program adjustment of the placement machine, the adjustment of the furnace temperature curve, and the detection of AOI. We believe that for SMT chip processing plants, good quality Products are produced, not reworked. Therefore, we are very strict in the control of the process, including the mixing time of the solder paste, the scrubbing time of the stencil, the verification of the first piece, the verification of the material loading, and the IPQC During inspections, we strictly follow the ISO9001:2008 system standards and continuously improve. Our pass-through rate for old models can reach over 99.99%, and the average pass-through rate is over 99.9%. At the same time, it can also support the patching of flexible circuit boards (FPC). During the SMT patching process, our engineers will summarize and analyze the manufacturability report, and raise issues regarding defects in circuit board production (which can easily lead to an increase in the defective rate of SMT patch packaging), so as to facilitate customers in optimizing the circuit board design process. , and overall help customers improve the throughput rate of electronic assembly
Quality Control of SMT PCBA
We attach great importance to the quality requirements of SMT processing customers, follow the international IPC electronic acceptance standards, strictly implement SOP operating procedures, and enhance the quality of SMT processing. Xinnuojie Electronics has accumulated rich experience in SMT patch processing technology. Common problems such as false soldering and lack of materials can be effectively controlled because we have adopted a standard management system based on international IPC and ISO9001 to ensure that products comply with standards. The process is implemented, positions are set up reasonably, and responsibilities are clear. IQC and IPQC quality control are implemented in place. In the long-term experience of serving foreign customers, the company has a prominent awareness of quality from the management to the grassroots employees, and does not let any potential problems flow into the next workstation. It aims to become the leader of Shenzhen SMT chip processing factories and continue to provide customers with refined products. Serve.
1. The Quality Control Department organizes the unqualified or non-compliant responsible department or the defect discovery department to review the non-conforming organizations and establish a problem-solving group.
2. Analyze potential defects or non-conformities through the use of testing, simulation, data analysis, QC techniques and other tools, carry out appropriate error-proofing design and quality control, and propose preventive measures plans.
3.For the bad or non-conforming items that have occurred, the problem solving team will re-evaluate and approve the correction of relevant technologies, quality standards or improve the process or design level, etc., confirm whether all products or processes related to the quality system have similar problems and conduct a comprehensive Prevent and propose solutions.
