We have 4 fully-automatic SMT patch processing production lines and 2 professional plug-in assembly lines. The patch capacity reaches 4 million points per day and the plug-in capacity can reach 1 million points. We currently have about 100 employees, including management personnel in the SMT industry. 5-8 years of experience,A strong team is the basis for providing customers with high-quality and efficient services. Therefore, we spare no effort in team building and will attract more senior talents to join our team in the future to build an excellent patch processing supplier and create products for customers. greater value.
introduce
SMT patch processing is to process the bare PCB board and mount electronic components on the PCB board. This is a popular electronic processing technology today, because electronic components are getting smaller and smaller, and there is a trend of gradually replacing DIP plug-in technology. The SMT chip processing process can be divided into pre-processing and processing. Before starting SMT patch processing, you need to prepare various PCB documents, circuit board information (Gerber), material list (BOM), auxiliary information, etc. These are the basis of SMT patch processing. After the preparation work is fully completed, SMT SMD processing.
SMT patch processing process capabilities
We also provide PCBA patch processing solutions. In terms of SMT process technology, we support leaded, low-temperature lead-free, high-temperature lead-free, and red glue processes. We can mount PCBs with sizes from 20mm*20mm to 420mm*500mm. The minimum package component is 0201. Supports the placement of BGA, PQFP, PLCC, SOP, SOJ and other integrated circuits. Fuji high-speed chip placement machines, multi-function machines, AOI optical detectors, eight-temperature zone reflow soldering, wave soldering and other equipment support production capacity realization and process quality. For each PCBA, we check everything from the printing steel mesh to the program adjustment of the placement machine, the adjustment of the furnace temperature curve, and the detection of AOI. We believe that for SMT chip processing plants, good quality Products are produced, not reworked. Therefore, we are very strict in the control of the process, including the mixing time of the solder paste, the scrubbing time of the stencil, the verification of the first piece, the verification of the material loading, and the IPQC During inspections, we strictly follow the ISO9001:2008 system standards and continuously improve. Our pass-through rate for old models can reach over 99.99%, and the average pass-through rate is over 99.9%. At the same time, it can also support the patching of flexible circuit boards (FPC). During the SMT patching process, our engineers will summarize and analyze the manufacturability report, and raise issues regarding defects in circuit board production (which can easily lead to an increase in the defective rate of SMT patch packaging), so as to facilitate customers in optimizing the circuit board design process. , and overall help customers improve the throughput rate of electronic assembly
| Manufacturing capacity | PCBA services | Equipment List |
| 4 SMT patch production lines | Circuit board manufacturing (up to 12 layers, blind and buried vias, impedance, thick copper, HDI) | Fuji CP8 Series placement machine |
| 2 DIP plug-in production lines | SMT/DIP | Fully automatic solder paste printing machine |
| 0201 component placement | ICT test | 10 temperature zone reflow soldering |
| 0.25mm BGA | FCT functional test | AOI optical detector |
| 4 million patches/day | BIT aging test | Wave soldering (lead, lead-free) |
| DIP 1 million points/day | Box Building finished product assembly | ICT test bench |
Quality control of patch processing
Value the quality requirements of SMT processing customers, follow the international IPC electronic acceptance standards, strictly implement SOP operating procedures, and strengthen SMT processing quality.We have adopted a standard management system based on international IPC and ISO9001 to ensure that products are executed in accordance with standard processes, with reasonable job placement and clear responsibilities. IQC and IPQC quality control are implemented in place. In the long-term experience of serving foreign customers, the company has a prominent awareness of quality from the management to the grassroots employees, and does not let any potential problems flow into the next workstation. It aims to become the leader of Shenzhen SMT chip processing factories and continue to provide customers with refined products. Serve.
1. The Quality Control Department organizes the unqualified or non-compliant responsible department or the defect discovery department to review the non-conforming organizations and establish a problem-solving group.
2. Analyze potential defects or non-conformities through the use of testing, simulation, data analysis, QC techniques and other tools, conduct appropriate error-proofing design and quality control, and propose preventive measures plans.
3.For the bad or non-conforming items that have occurred, the problem solving team will re-evaluate and approve the correction of relevant technologies, quality standards or improve the process or design level, etc., confirm whether all products or processes related to the quality system have similar problems and conduct a comprehensive Prevent and propose solutions.
