ICT is mainly used for electrical testing of printed circuit board assembly (PCBA). Basically, you can think of it as an advanced multimeter or LCR meter. It does not require disassembling electronic parts from the circuit board. After that, you can use the pin points to check the electrical properties of all the parts on the circuit board and whether there are any open/short circuit problems in the welding.
The operating principle of ICT is to use a bed of nails to connect pre-arranged test points (Test Points) on the circuit board to achieve the purpose of testing individual parts or Nets. Just like when you take the resistors on both sides of the three-purpose electric meter, you need to place the probe at both ends of the resistor. ICT must also use pin points to place the test points extending from the contact pins of all parts to measure. Sometimes you can also put a Imagine the circuit of a string or partial block as a component, and then measure its equivalent resistance value, capacitance value and voltage. This can reduce the number of test points. Generally, we will call such measurement a Nets test.
The main defects in general circuit board assembly are mostly concentrated in welding open circuits, short circuits, offsets, missing parts, wrong parts, etc., accounting for more than 90% of the defects. Except for some defects, the rest can be eliminated through ICT testing. Good products are 100% picked out. “Offset” may not necessarily be detected through ICT electrical testing, because as long as the parts’ legs are still welded in place and there is no abnormality in the electrical testing, it cannot be detected. In fact, it remains to be seen whether such defects are considered defects. There is room for further clarification, which is not necessarily bad. In addition, the intermittent phenomenon caused by cold/false soldering may not be 100% picked out by ICT. This should be the biggest headache, because ICT detects circuits through electrical testing. If the test When the solder joints are just in contact, they cannot be detected.
PCBA program burning process capabilities
- Open circuit (open), short circuit (short), detect wrong parts, missing parts, erect monuments, build bridges, and reverse polarity.
- Can measure resistance (resister), capacitance (capacitor), inductor (Inductor), transistor, diode (diode), Zener diode, triode measurement (triode) optocoupler, relay, field effect transistor test (FET), IC , connectors and other parts.
- Through TestJet, you can measure the short circuit of PIN connectors or IC parts with solder pins outside without the need for pinpoints.
- DC/AC voltage measurement and frequency measurement.
- Electrical function test. You can execute low-level programs (such as BIOS) to do self-tests.
- You can use [Boundary-scan/JTAG] to test the function of active parts.
7.Can automatically download software or operating system to the memory of the circuit board
Quality control of PCBA program firing
1. The Quality Control Department organizes the unqualified or non-compliant responsible department or the defect discovery department to review the non-conforming organizations and establish a problem-solving group.
2. Analyze potential defects or non-conformities through the use of testing, simulation, data analysis, QC techniques and other tools, conduct appropriate error-proofing design and quality control, and propose preventive measures plans.
3 For the bad or non-conforming items that have occurred, the problem solving team will re-evaluate and approve the correction of relevant technologies, quality standards or improve the process or design level, etc., confirm whether all products or processes related to the quality system have similar problems and conduct a comprehensive Prevent and propose solutions.
