Conventional process technology capabilities
project | project type | content | Process capability | Remark |
| 1 | material type | plate | FR-4 | Kingboard KB6164 (TG140) Kingboard KB6165F(TG150) Kingboard KB6167F(TG170) Kingboard KB6160(TG130) |
| FR-4(Halogen-free) | Kingboard KBHF140 halogen-free sheet Shengyi SH260 plate | |||
| FR-4(black core) | Guoji GF113 series black core board | |||
| CEM-1 | Kingboard KB5150 plate | |||
| 2 | material type | ink | Widely believed | Guangxin liquid photosensitive solder mask ink |
| sun | sun text spray ink | |||
| 3 | Overall process capability | Number of layers | 1-36 floors | Refers to the number of electrical layers (copper layers) in the PCB. Currently, Hunting Board only accepts 1 to 20-layer through-hole boards and blind-buried-hole boards. |
| 4 | Overall process capability | Laminated structure | 4th floor, 6th floor, 8th floor, 10th floor, 12th floor | View Laminated Construction |
| 5 | Overall process capability | Impedance tolerance (minimum) | ±10% | For example, the selected impedance value is T=50Ω, and the actual impedance is 45Ω（T－50Ω×10%）～55Ω（T＋50Ω×10%） |
| 6 | Overall process capability | Production board size (maximum) | 1000×600mm | Single and double: single piece and panel 1000*600mm (the VCUT direction cannot exceed 600mm) Four layers: single piece 1000*500mm, panel 1000*480mm (the VCUT direction cannot exceed 480mm) Six layers: single piece 900*500mm, panel 900*480mm (the VCUT direction cannot exceed 480mm) Eight layers: single piece 625*500mm, panel 625*480mm (the VCUT direction cannot exceed 480mm) Ten/twelve layers: single piece 400*300mm, panel 600*480mm (the VCUT direction cannot exceed 480mm) |
| 7 | Overall process capability | Production board size (minimum) | 1×3mm | The minimum production size of single board is >1×3mm, and ≤20×20mm is ultra-small board. Minimum production size of panel>60×60mm Minimum production size of V-grooved panels＞80×80mm Remarks: OSP≥50*80mm, immersed tin≥80*120MM |
| 8 | Overall process capability | Board thickness (maximum) | 3.0mm | Plate thickness: 0.25/0.3/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0mm |
| 9 | Overall process capability | Board thickness (minimum) | 0.25mm | |
| 10 | Overall process capability | Core board thickness (minimum) | 0.20mm | Copper thickness (can be customized to a minimum of 0.10mm) |
| 11 | Overall process capability | Insulation layer thickness (minimum) | 0.07mm | The thickness of PP film after lamination is 0.07mm |
| 12 | Overall process capability | Finished product thickness tolerance (plate thickness ≥ 0.8mm) | ±10% | For example, the plate thickness T=1.6mm, the actual plate thickness is 1.44mm (T-1.6×10%) ~ 1.76mm (T+1.6×10%) |
| 13 | Overall process capability | Finished product thickness tolerance (0.3mm≤plate thickness<0.8mm) | ±0.10mm | For example, the plate thickness T=0.6mm, the actual plate thickness is 0.5mm（T-0.1）～0.7mm（T+0.1） |
| 14 | Overall process capability | Warpage (minimum) | 0.75% | Diagonal length*0.75% (can be customized ≤0.5%) |
| 15 | Overall process capability | High-end option process | V-CUT length is not limited, four wires Flying test, two-color solder mask, two-color text | The distance between the last two cuts of V-CUT is ≥2mm Minimum pad for flying test ≥ 4*8mil (this will take effect when high-end charges are added) Two-color solder mask seamless butt tolerance +/-1mm |
| 16 | drilling | Drill hole diameter (maximum) | Φ6.5mm | Holes larger than 6.5mm can be expanded |
| 17 | drilling | Drill hole diameter (minimum) | Φ0.15mm | 0.15mm is the minimum hole diameter for drilling |
| 18 | drilling | With copper half hole aperture (minimum) | Φ0.60mm | Less than this parameter, evaluated based on actual data |
| 19 | drilling | HDI aperture (minimum) | Φ0.10mm | Less than this parameter, evaluated based on actual data |
| 20 | drilling | Hole Diameter Tolerance (Plated Through Holes) | ±0.075mm（±0.05mm can be specified） | Copper-plated holes: The tolerance of drilling is ±0.075mm, for example, the hole is designed to be 0.6mm. The finished hole diameter of the physical board is 0.525mm-0.675mm, which is acceptable (the holes with VIA attributes are via holes and are not subject to tolerance control) |
| 21 | drilling | Hole Diameter Tolerance (Non-Plated Through Holes) | ±0.05mm | Non-copper-plated holes: The tolerance of drilling is ±0.05mm, for example, the design is 0.6mm Hole, the finished hole diameter of the physical board is 0.55mm-0.65mm, which is acceptable. |
| 22 | drilling | Hole position tolerance | ±0.05mm | / |
| 23 | line | Finished copper thickness of outer layer (minimum) | 1oz | Refers to the minimum thickness of the outer circuit copper foil of the finished circuit board. The minimum thickness of the hunting board is: 1oz |
| 24 | line | Finished copper thickness of outer layer (maximum) | 4oz | Refers to the maximum thickness of the outer circuit copper foil of the finished circuit board (the copper thickness can be customized ≤10oz) |
| 25 | line | Finished copper thickness of inner layer (minimum) | Hoz | Refers to the minimum thickness of the copper foil of the inner circuit board of the finished circuit board. The minimum thickness of the hunting board should be Hoz |
| 26 | line | Inner layer finished copper thickness (maximum) | 3oz | Refers to the maximum thickness of the inner circuit copper foil of the finished circuit board (the copper thickness of the board can be customized ≤ 4oz) |
| 27 | line | Outer layer design line width/space (minimum) | T/Toz: 2.5mil/2.5mil(T=1/3oz) H/Hoz: 2.5mil/2.5mil 1/1oz: 3mil/3mil 2/2oz: 6mil/6mil 3/3oz: 10mil/10mil 4/4oz:14 mil/14mil | / |
| 28 | line | Inner layer design line width/spacing (minimum) | T/Toz: 2.5mil/2.5mil(T=1/3oz) H/Hoz: 2.5mil/2.5mil 1/1oz: 3mil/3mil 2/2oz: 6mil/6mil 3/3oz: 10mil/10mil 4/4oz:14 mil/14mil | / |
| 29 | line | Etching tolerance | ±20% (10% can be specified) | For example, line width T=4mil, the actual line width is 3.2mil (T-4mil×20%) ~ 4.8mil (T+4mil×20%) |
| 30 | line | Hole position accuracy of outer layer graphics (minimum) | ±3milThe hole position accuracy of the circuit image, if the difference between the actual object and ±3mil is qualified | / |
| 31 | line | Hole position to hole position accuracy (minimum) | ±2mil | The accuracy of the circuit image hole position to the actual hole position ±2mil is qualified. |
| 32 | line | Hole pitch/hole-to-wire process range | VIA via hole to hole 0.25mm PTH component hole to component hole 0.5mm VIA via hole to line 0.2mm PTH component hole to line 0.3mm | VIA via hole to hole 0.25mm PTH component hole to component hole 0.5mm VIA via hole to line 0.2mm PTH component hole to line 0.3mm |
| 33 | Immersed copper plate | Hole Plating Aspect Ratio (Max) | 10:1 | Can be customized to less than or equal to 20:1 |
| 34 | Immersed copper plate | Hole wall copper thickness (through hole) | Conventional average ≥18μm | Our company routinely upgrades the hole copper average to ≥18um to improve PCB conduction stability and anti-aging capabilities, but customers can specify otherwise. |
| 35 | solder mask | Solder mask alignment accuracy tolerance | ±3mil | The line image is qualified if the soldering mask position accuracy tolerance is ±3mil. |
| 36 | solder mask | Solder mask thickness (minimum) | ≥8μm | The solder mask uses Guangxin ink ≥8μm |
| 37 | solder mask | Solder mask bridge width (minimum) | Green oil: 4mil Black/white/pink: 5mil Other variegated oils: 4mil | If there are solder mask bridge requirements, please note! If the solder mask color is green, it is reserved between pads. The ink width must be ≥4mil (required to complete the line pad spacing with a copper thickness of 1oz 7mil), the remaining ink width between black, white, and pink pads must be ≥5mil (To complete a line with a copper thickness of 1oz, the pad spacing needs to be 7mil), other variegated oil The remaining ink width between pads must be ≥4mil |
| 38 | solder mask | Solder mask hole diameter | ≤0.45mm | The solder resist plug hole diameter is ≤0.45mm. When the hole in the board is ≥0.45mm, the default oil plug will not be full. |
| 39 | character | character | The minimum text line width is 0.1mm, the minimum character height and width are 0.7 X 0.7 mm | The ratio of character height and width to text line width needs to be ≥6:1 (outside the range, the text will be blurred, and the best ratio is conducive to production) |
| 40 | Surface treatment | heavy gold | NI:100-200uin（μ”） Au:1-3uin（μ”） | Special needs can be specified |
| 41 | Surface treatment | nickel palladium | NI:200u” Pd:1-10u” Au:1-10u” | Special requirements can be specified. The specified thickness of palladium and gold for nickel-palladium gold shall not exceed 30u”, and the specified thickness of nickel shall not exceed 300u”. |
| 42 | Surface treatment | Lead/lead-free spray tin | 2-40μm | / |
| 43 | Surface treatment | Electric (nickel) gold (hard gold) | NI:120-200u” AU 1-100 u” | The ingredients are alloys (gold palladium, gold nickel, gold cobalt, gold chromium, gold bismuth, etc.) such as full-page electro-gold, non-standard orders, gold thickness can be specified separately |
| 44 | Surface treatment | Choose gold plating + fingers | AU:3-100u” | Optional leads – you need to choose whether to leave a residue or not when placing an order. |
| 45 | shape | Milling profile tolerance | ±5.2mil(0.13mm) | Limit ±2MIL (0.1mm); V-CUT board single board dimension tolerance is ±9.8MIL (0.25mm) |
| 46 | shape | Milling profile tolerance (hole to edge) | ±7mil（0.177MM） | Limit ±6mil (0.15MM) |
| 47 | shape | Milling profile arc (inner angle) (minimum) | R≥0.5mm | / |
| 48 | shape | Milling countersunk hole diameter | According to customer requirements | According to customer requirements |
| 49 | shape | V-CUT residual thickness | 1/3 of finished plate thickness | Support special requirements |
| 50 | shape | V-CUT remaining thickness tolerance (minimum) | ±0.10mm | V-CUT remaining thickness tolerance minimum ±0.10mm |
| 51 | shape | V-CUT misalignment (minimum) | 0.10mm | V-CUT misalignment minimum 0.10mm |
| 52 | shape | V-CUT plate thickness (minimum/maximum) | 0.5mm/3.2mm | Currently supports V-CUT plate thickness 0.5mm ~ 3.2mm (2.4 ≤ plate thickness ≤ 0.4mm recommended stamp hole, if V-CUT is specified, the default does not meet the ±0.10mm tolerance) |
Carbon oil process
serial number | project | Specification | Remark |
| 1 | thickness | 0.4-2mil±0.4mil | The boundary is divided by 1mil. When the thickness is ≥1mil, secondary printing is required. |
| 2 | Carbon oil surface width | Regular 16mil or above, minimum 14mil | less than needs assessment |
| 3 | Carbon bridge width | Regular 16mil or more, minimum 12mil | less than needs assessment |
| 4 | Carbon oil resistance | Normal≤50Ω | Can be customized below 200Ω |
Countersunk hole technology
serial number | project | Specification | Remark |
| 1 | Countersunk T type | Depth ≥0.2mm; Hole size ≥ 2mm; PTH hole tolerance +/-0.2mm; NPTH hole tolerance +/-0.15mm; | It can be customized beyond the range; also known as deep hole control; |
| 2 | Countersunk head V type | Regular angle 90°; Hole size 4-20mm; PTH hole tolerance +/-0.2mm; NPTH hole tolerance +/-0.15mm; | Over-range can be evaluated and customized; also known as speaker hole; |
Resin plugging process
serial number | project | Specification | Remark |
| 1 | ink | Sumitomo resin ink | / |
| 2 | Production size | Veneer size length ≤ 650mm | Oversize needs assessment |
| 3 | Plate thickness | 0.2-8.0mm | Over-specification needs assessment |
| 4 | Plug hole diameter | 0.2-1.0mm | Over-specification needs assessment |
| 5 | Big and small holes | The size difference between adjacent holes is within 0.2mm | The difference cannot exceed this value, otherwise we need to default to allowing our company to reduce the hole to reach the range value. |
| 6 | orifice depression | Aperture ≤ 0.4mm, depression ≤ 5μm Aperture ≤ 0.4mm, depression ≤ 15μm | Aperture ≤ 0.4mm, depression ≤ 15μm Aperture＞0.4mm, depression≤50μm Controlling zero sag requires technical re-evaluation |
Four-layer board lamination structure diagram
 | Copper thickness: | 0.5-1.50Z | ||
| PP glue: | 2116 | 0.125 | mm | |
| Core board: | Contains 0.5-1oz copper | 0.4 | mm | |
| PP glue: | 2116 | 0.125 | mm | |
| Copper thickness: | 0.5-1.50Z | |||
| Finished plate thickness: | 0.8 | ±0.1 | mm | |
 | Copper thickness: | 0.5-1.50Z | ||
| PP glue: | 2313 | 0.095 | mm | |
| Core board: | Contains 0.5-1oz copper | 0.5 | mm | |
| PP glue: | 2313 | 0.095 | mm | |
| Copper thickness: | 0.5-1.50Z | |||
| Finished plate thickness: | 0.8 | ±0.1 | mm | |
 | Copper thickness: | 0.5-1.50Z | ||
| PP glue: | 2116 | 0.125 | mm | |
| Core board: | 含铜0.5-1oz | 0.4 | mm | |
| PP glue: | 2116 | 0.125 | mm | |
| Copper thickness: | 0.5-1.50Z | |||
| Finished plate thickness: | 0.8 | ±0.1 | mm | |
 | Copper thickness: | 1.50Z | ||
| PP glue: | 7628H+1080 | 0.25 | mm | |
| Core board: | Contains 0.5-1oz copper | 0.56 | mm | |
| PP glue: | 7628H+1080 | 0.25 | mm | |
| Copper thickness: | 1.50Z | |||
| Finished plate thickness: | 1.2 | ±0.1 | mm | |
 | Copper thickness: | 0.5-1.50Z | ||
| PP glue: | 7628 | 0.185 | mm | |
| Core board: | Contains 0.5-1oz copper | 0.7 | mm | |
| PP glue: | 7628 | 0.185 | mm | |
| Copper thickness: | 0.5-1.50Z | |||
| Finished plate thickness: | 1.2 | ±0.1 | mm | |
| | Copper thickness: | 0.5-1.50Z | ||
| PP glue: | 2116 | 0.11 | mm | |
| Core board: | Contains 0.5-1oz copper | 0.7 | mm | |
| PP glue: | 2116 | 0.11 | mm | |
| Copper thickness: | 0.5-1.50Z | |||
| Finished plate thickness: | 1.2 | ±0.1 | mm | |
 | Copper thickness: | 1.50Z | ||
| PP glue: | 7628*2 | 0.35 | mm | |
| Core board: | Contains 0.5-1oz copper | 0.76 | mm | |
| PP glue: | 7628*2 | 0.35 | mm | |
| Copper thickness: | 1.50Z | |||
| Finished plate thickness: | 1.6 | ±0.1 | mm | |
 | Copper thickness: | 0.5-1.50Z | ||
| PP glue: | 7628 | 0.185 | mm | |
| Core board: | Contains 0.5-1oz copper | 1.1 | mm | |
| PP glue: | 7628 | 0.185 | mm | |
| Copper thickness: | 0.5-1.50Z | |||
| Finished plate thickness: | 1.6 | ±0.1 | mm | |
 | Copper thickness: | 0.5-1.50Z | ||
| PP glue: | 2116 | 0.12 | mm | |
| Core board: | Contains 0.5-1oz copper | 1.2 | mm | |
| PP glue: | 2116 | 0.12 | mm | |
| Copper thickness: | 0.5-1.50Z | |||
| Finished plate thickness: | 1.6 | ±0.1 | mm | |
 | Copper thickness: | 1.50Z | ||
| PP glue: | 7628+7628H | 0.37 | mm | |
| Core board: | Contains 0.5-1oz copper | 1.1 | mm | |
| PP glue: | 7628+7628H | 0.37 | mm | |
| Copper thickness: | 1.50Z | |||
| Finished plate thickness: | 2 | ±0.1 | mm | |
 | Copper thickness: | 1.50Z | ||
| PP glue: | 7628*2 | 0.35 | mm | |
| Core board: | Contains 0.5-1oz copper | 1.16 | mm | |
| PP glue: | 7628 | 0.35 | mm | |
| Copper thickness: | 0.5-1.50Z | |||
| Finished plate thickness: | 2 | ±0.1 | mm | |
 | Copper thickness: | 0.5-1.50Z | ||
| PP glue: | 7628 | 0.185 | mm | |
| Core board: | Contains 0.5-1oz copper | 1.5 | mm | |
| PP glue: | 7628 | 0.185 | mm | |
| Copper thickness: | 0.5-1.50Z | |||
| Finished plate thickness: | 2 | ±0.1 | mm | |
 | Copper thickness: | 1.50Z | ||
| PP glue: | 7628*2 | 0.35 | mm | |
| Core board: | Contains 0.5-1oz copper | 1.56 | mm | |
| PP glue: | 7628*2 | 0.35 | mm | |
| Copper thickness: | 1.50Z | |||
| Finished plate thickness: | 2.4 | ±0.1 | mm | |
 | Copper thickness: | 0.50Z | ||
| PP glue: | 7628 | 0.185 | mm | |
| Core board: | Contains 0.5-1oz copper | 1.9 | mm | |
| PP glue: | 7628 | 0.185 | mm | |
| Copper thickness: | 0.50Z | |||
| Finished plate thickness: | 2.4 | ±0.1 | mm | |
 | Copper thickness: | 1.50Z | ||
| PP glue: | 2116*2 | 0.2 | mm | |
| Core board: | Contains 0.5-1oz copper | 2.43 | mm | |
| PP glue: | 2116*2 | 0.2 | mm | |
| Copper thickness: | 1.50Z | |||
| Finished plate thickness: | 3 | ±0.1 | mm | |
 | Copper thickness: | 0.50Z | ||
| PP glue: | 2116+7628 | 0.3 | mm | |
| Core board: | Contains 0.5-1oz copper | 2.3 | mm | |
| PP glue: | 2116+7628 | 0.3 | mm | |
| Copper thickness: | 0.50Z | |||
| Finished plate thickness: | 3 | ±0.1 | mm | |
Six-layer board lamination structure diagram
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2116*2 | 0.24 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1 | ±0.1 | MM | |
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 2116RC56 | 0.125 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1 | ±0.1 | MM | |
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 7628 | 0.185 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 2116*2 | 0.22 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628 | 0.185 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1 | ±0.1 | MM | |
| | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628*2 | 0.125 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.2 | ±0.1 | MM | |
| | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 7628 | 0.185 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628RC26 | 0.2 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628 | 0.185 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.2 | ±0.1 | MM | |
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2313 | 0.095 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 2116*2 | 0.11 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 2313 | 0.095 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.2 | ±0.1 | MM | |
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 2116*2 | 0.24 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.6 | ±0.1 | MM | |
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2116 | 0.125 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 7628RC26 | 0.2 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 7628 | 0.125 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.6 | ±0.1 | MM | |
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 2116*2 | 0.24 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2 | ±0.1 | MM | |
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 7628RC26 | 0.2 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2 | ±0.1 | MM | |
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.9 | MM | |
| PP glue: | 2116*2 | 0.24 | MM | |
| Core board: | Contains copper | 0.9 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2 | ±0.1 | MM | |
 | Copper thickness: | 0.15-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.9 | MM | |
| PP glue: | 7628RC26 | 0.2 | MM | |
| Core board: | Contains copper | 0.9 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2 | ±0.1 | MM | |
| | Copper thickness: | 2 OZ | ||
| PP glue: | 1080*3 | 0.18 | MM | |
| Core board: | Contains copper | 1.1 | MM | |
| PP glue: | 1080*4 | 0.2 | MM | |
| Core board: | Contains copper | 1.1 | MM | |
| PP glue: | 1080*3 | 0.18 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2 | ±0.1 | MM | |
| | Copper thickness: | 0.5 OZ | ||
| PP glue: | 7628 | 0.18 | MM | |
| Core board: | Contains copper | 1.1 | MM | |
| PP glue: | 7628RC26 | 0.36 | MM | |
| Core board: | Contains copper | 1.1 | MM | |
| PP glue: | 2116 | 0.18 | MM | |
| Copper thickness: | 0.5 OZ | |||
| Finished plate thickness: | 3 | ±0.1 | MM | |
Eight-layer board lamination structure diagram
 | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 2116 | 0.11 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 1080*2 | 0.15 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 1080*2 | 0.15 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2116 | 0.11 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.2 | ±0.1 | MM | |
 | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 2116 | 0.11 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2116RC56 | 0.125 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2116RC56 | 0.125 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2116 | 0.11 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.2 | ±0.1 | MM | |
 | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 2116*2 | 0.24 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 2116*2 | 0.24 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.6 | ±0.1 | MM | |
| | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 7628 | 0.185 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628 | 0.185 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.6 | ±0.1 | MM | |
 | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 1.6 | ±0.1 | MM | |
 | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 2116*2 | 0.22 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 2116*2 | 0.22 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2 | ±0.1 | MM | |
| | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 2116 | 0.125 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 7628 | 0.125 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2 | ±0.1 | MM | |
 | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 2116 | 0.12 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 2116 | 0.12 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2 | ±0.1 | MM | |
 | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 7628 | 0.175 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 2116*2 | 0.22 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 2116*2 | 0.22 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 7628 | 0.175 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2.4 | ±0.1 | MM | |
 | Copper thickness: | 0.5-1.5 OZ | ||
| PP glue: | 7628 | 0.185 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 7628RC46 | 0.2 | MM | |
| Core board: | Contains copper | 0.5 | MM | |
| PP glue: | 7628 | 0.185 | MM | |
| Copper thickness: | 0.5-1.5 OZ | |||
| Finished plate thickness: | 2.4 | ±0.1 | MM | |
 | Copper thickness: | 2 OZ | ||
| PP glue: | 1080*3 | 0.18 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 1080*2+106*2 | 0.15 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 1080*2+106*2 | 0.15 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 1080*3 | 0.18 | MM | |
| Copper thickness: | 2 OZ | |||
| Finished plate thickness: | 3 | ±0.1 | MM | |
 | Copper thickness: | 0.5 OZ | ||
| PP glue: | 7628 | 0.175 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 2116*2 | 0.22 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 2116*2 | 0.22 | MM | |
| Core board: | Contains copper | 0.7 | MM | |
| PP glue: | 7628 | 0.175 | MM | |
| Copper thickness: | 0.5 OZ | |||
| Finished plate thickness: | 3 | ±0.1 | MM | |
Ten-layer board lamination structure diagram
 | Copper thickness: | 0.5 OZ | ||
| PP glue: | 2313 | 0.09 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2313 | 0.09 | MM | |
| Copper thickness: | 0.5 OZ | |||
| Lamination thickness: | 1.56 | ±0.1 | MM | |
| Finished plate thickness: | 1.6 | ±0.1 | MM | |
 | Copper thickness: | 0.5 OZ | ||
| PP glue: | 1080 | 0.075 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2313 | 0.075 | MM | |
| Copper thickness: | 0.5 OZ | |||
| Lamination thickness: | 1.53 | ±0.1 | MM | |
| Finished plate thickness: | 1.6 | ±0.1 | MM | |
 | Copper thickness: | 0.5 OZ | ||
| PP glue: | 7628 | 0.18 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628 | 0.18 | MM | |
| Copper thickness: | 0.5 OZ | |||
| Lamination thickness: | 1.94 | ±0.1 | MM | |
| Finished plate thickness: | 2 | ±0.1 | MM | |
 | Copper thickness: | 0.5 OZ | ||
| PP glue: | 1080 | 0.075 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 7628H | 0.18 | MM | |
| Core board: | Contains copper | 0.4 | MM | |
| PP glue: | 1080 | 0.075 | MM | |
| Copper thickness: | 0.5 OZ | |||
| Finished plate thickness: | 2.4 | ±0.1 | MM | |
Twelve-layer board lamination structure diagram
 | Copper thickness: | 0.5 OZ | ||
| PP glue: | 1080 | 0.075 | MM | |
| Core board: | Contains copper | 0.15 | MM | |
| PP glue: | 7628 | 0.16 | MM | |
| Core board: | Contains copper | 0.15 | MM | |
| PP glue: | 7628 | 0.16 | MM | |
| Core board: | Contains copper | 0.15 | MM | |
| PP glue: | 7628 | 0.16 | MM | |
| Core board: | Contains copper | 0.15 | MM | |
| PP glue: | 7628 | 0.16 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 1080 | 0.075 | MM | |
| Copper thickness: | 0.5 OZ | |||
| Lamination thickness: | 1.58 | ±0.1 | MM | |
| Finished plate thickness: | 1.6 | ±0.1 | MM | |
 | Copper thickness: | 0.5 OZ | ||
| PP glue: | 1080 | 0.075 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628 | 0.19 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628 | 0.19 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628 | 0.19 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 7628 | 0.19 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 1080 | 0.075 | MM | |
| Copper thickness: | 0.5 OZ | |||
| Finished plate thickness: | 2 | ±0.1 | MM | |
 | Copper thickness: | 0.5 OZ | ||
| PP glue: | 2116H | 0.12 | MM | |
| Core board: | Contains copper | 0.25 | MM | |
| PP glue: | 7628H | 0.2 | MM | |
| Core board: | Contains copper | 0.15 | MM | |
| PP glue: | 7628H | 0.2 | MM | |
| Core board: | Contains copper | 0.15 | MM | |
| PP glue: | 7628H | 0.2 | MM | |
| Core board: | Contains copper | 0.15 | MM | |
| PP glue: | 7628H | 0.2 | MM | |
| Core board: | Contains copper | 0.2 | MM | |
| PP glue: | 2116H | 0.12 | MM | |
| Copper thickness: | 0.5 OZ | |||
| Lamination thickness: | 2.33 | ±0.1 | MM | |
| Finished plate thickness: | 2.4 | ±0.1 | MM | |
| General process | Quality craftsmanship | |||
| drilling | 1. When the word square appears in the hole diagram in GERBER, our company will make such holes circular according to the file, which is slightly different from the customer’s idealization, because all drills are circular, not square 2. Short slotted holes and large holes exceeding a certain specification are easily deformed during the production process, resulting in defects in the products delivered to customers. In order to avoid these defects, we specialize in such situations in lean engineering. be corrected |  | 1. When the word square appears in the hole diagram in GERBER, our company will make such holes circular according to the file, which is slightly different from the customer’s idealization, because all drills are circular, not square 2. Our company first adds pre-drilled holes at the symmetrical end points to reduce hole deformation and the pressure of continuous high-frequency operation of special drills, so that the drilled holes can be closer to the customer’s design. |  |
| line | 1. Customers will inevitably have omissions in the design data or software restrictions that are not flexible enough. Ordinary projects will be designed according to the data to ensure that the shipped boards and data are consistent. However, such boards will cause problems to customers after use. Some parts are defective, or after long-term use, it affects the performance of the end product. 2. When processing the circuit, due to incomplete design data, many small gaps appeared. If this result is put into production, it will cause defects in the copper surface of the board. |  | 1. Our company will try its best to find out the design errors and deal with them. During the process, we will check the customer’s terminal information and make modifications within the scope of complete confidence. After the modification, we can ensure the yield rate of customers’ use or testing and extend the time. End product usability 2. We will pick out the small gaps in such copper sheets and fill them with copper sheets. In this way, there will be no defects in the copper sheets on the board. |  |
| solder mask | For normal board making, copper exposure at the edge of the pad is accepted by default, which is slightly different from the pad shape and size designed for the terminal. |  | When processing the pads, the wire ends connected to the pads will be covered with ink normally, so that the size and shape of the pads will be closer to the requirements of the terminal design. |  |
| Word | Produced according to customer design files, must read when placing orders on the front end, the text accepted by default is unrecognizable |  | When the text designed by the customer does not meet our company’s size requirements, we will try our best to enlarge the text so that it can be legible. |  |
| forming | 1. There are slight gaps in the design data. After the data is processed, it will cause the size of the small boards on each connected piece to be inconsistent after being broken. 2. For all angles less than or equal to 90 degrees, our company only adds necessary angles, such as USB slots. |  | 1. The appearance of each small board will be sorted out and placed neatly. The board produced in this way will have the same shape and size when used. 2. Our company will add or remove cloak holes for all angles less than or equal to 90 degrees. |  |
| impedance | According to our company’s unique specified lamination structure, the impedance line adjustment is not restricted, as long as the impedance is reached. | If the impedance is adjusted to a line width of 2MIL or more, an impedance production confirmation form will be sent to the customer. | ||
| Multi-color solder mask | Multi-color solder mask cannot be customized. If the data is not designed or the design is wrong, our company will make it according to the customer’s data. |  | After the customer accurately gives the requirements, multi-color solder mask production can be customized. Engineers can carefully process the multi-color solder mask data to create the effect of multiple solder mask colors. |  |
| Multi-color or distinctive text requirements | 1. The customer noted that the white oil block covers the solder pad and the solder pad data design is for normal window opening. Our company defaults to making according to the design data and ignores the remark requirements. 2. The white oil block will be designed according to the customer’s data and even the soldering pad will be covered. The default is not to change the customer’s original design data. |  | 1. If the customer remarks that the white oil block covers the soldering pad, and the terminal data design conflicts with the remarks, our company will change the terminal design data according to the customer’s remarks. 2. The terminal design information will be changed according to the customer’s remarks, and the solder pads will be accurately selected to remove the text. |  |
| Special remarks to modify the file | Always follow the order requirements and ignore all requirements except in the order interface. | The customer can provide a relatively simple order making requirement (note: the requirements in the GERBER image data will still be ignored). On the basis of not increasing the cost, the engineering staff will make it as required. If there are any questions, please ask EQ ( Engineering and customer communication inquiry form) | ||
| serial number | work issues project | Detailed description of the problem (please read it carefully, it is very important) |
| 1 | drilling rig | All holes that are as big as the circuit pads, circuit pads are smaller than the holes, holes without circuit pads, and holes without electrical performance connections (those without ground wires and copper) will be made uniformly as NPTH holes. , and ignore the requirements for such holes in hole diagrams and elsewhere |
| 2 | The minimum non-metalized groove produced by our company is 0.8mm, and the minimum metalized groove is 0.4mm (referring to the original design size). If it is smaller than this specification, we will take the center of the groove as the standard and increase it to 0.8MM or 0.4MM on both sides. To make, only add width but no length | |
| 3 | If there are individual copper VIA via holes (the VIA holes are only used for electrical conduction, not plug-in holes) because the spacing is too small and cannot be moved, making it impossible for our company to process, we will be able to reduce the size by ourselves. Hole-like, narrowed range within 0.1MM | |
| 4 | For boards with half-hole designs, please accept copper burrs in the finished holes and slight copper pulling on the edge of the half-hole board. Because our production process is to be unified, we cannot produce it separately according to the special half-hole process. Our company’s Half-hole processing, the minimum hole must be 1.0MM and the number of single small plates cannot exceed 5 | |
| 5 | line | This type of circuit has a large pad on one side and no pad on the other side. When there is enough space in the PCB file to make it, we will make it according to the PTH hole by default. In order to ensure that our company can produce smoothly, we will directly Add a small circuit pad 0.127MM larger than the hole on the side without circuit pads, and this small pad will expose the copper surface process |
| 6 | solder mask | If the solder mask (solder) conflicts with the upper tin layer and the patch layer, and when the solder mask has more windows than the upper tin layer and patch layer, we will directly make it according to the solder mask layer (please ask When updating and upgrading, be sure to pay attention to the omission of the windows in the lower solder mask layer). When the solder mask layer has fewer windows than the upper tin layer, we will issue an EQ to ask your company questions. |
| 7 | The window corresponding to the PTH hole of the plug-in has a window on one side and no window on the other side. To ensure that the ink does not enter the hole, we need to add a unilateral solder mask 0.1MM larger than the hole on the side without the window. Oil spots and exposed copper surface will appear around the finished hole. | |
| 8 | For the design information of AD series, Protel series, etc., we will always follow the design of the through-hole VIA processing method according to the oil cover, PADS, Gerber and other forms of files, and the through-hole VIA processing method will be based on the file design. When opening the window, open the window and cover the oil. Just make the cover oil, we will ignore the requirements in the PCB board and the order requirements (because deleting your company’s GERBER file window will often delete the window your company needs), if you have special requirements, you need to make special remarks. | |
| 9 | For boards that require ink plug holes, unless there are special remarks that the plug holes must be 100% full, we will make them according to the ordinary plug holes that can transmit green light but not white light. | |
| 10 | Word | On the text layer, we will add our company’s mark and our company’s production number. The mark is added to the single small board, and the number is added first to the process edge. If there is no process edge, we will also add it with the mark to the board, so that it is convenient for you. Identification and distinction between the two companies (we will not add any marks if there is no text silk screen layer and there is no space in the veneer. Please make special remarks if there is a text layer that cannot be marked). Otherwise, even if your company provides documents that have been produced before, our company It will also default to allow adding our company’s internal identification factory code (our company’s internal identification factory code is not necessarily consistent with the shipping model, it is just an identification number, which can be used as our company’s factory identification, and can also prevent internal confusion. plate |
| 11 | If the line width of the text design is less than 6 mil or the character height is less than 36 mil, we will not accept the text requirement of high definition. If the text design line width is less than 5 mil or the character height is less than 30 mil, we will not accept the requirement of the text being fully legible (there may be fat in some parts). Vague). If the line width of the text design is less than 4mil or the character height is less than 28mil, please accept the blurring of the text. | |
| 12 | For designs like this, where most of the text is on the soldering pads, we will assume that your company already has an assembly drawing that can be used, and use the soldering pads to remove the text directly from the data. By then, the text will be unrecognizable on the finished board, and we do not accept it. Complaints about such text being removed | |
| 13 | If the text design is reversed during your company’s engineering design, it will be difficult to find it when we produce the project. We will try our best to find it, but we cannot accept complaints about such reversed characters. Our company defaults to adding year and week to the cycle. The current starting week for producing production data | |
| 14 | Passive upgrade of surface technology | If the customer’s sample surface technology is one of the following three: Level 1 – leaded tin spraying, Level 2 – lead-free tin spraying, Level 3 – immersion gold. Then when we make boards, low-level surface technology will likely be replaced by high-level surface technology, because we not only need to classify orders, but also need to quickly integrate orders to meet the absolute needs of smooth factory flow and factory efficiency. The needs of most customers, thank you for your understanding! |
| 15 | Objects inside the shape | The electric milling position (board frame edge and internal milling groove) needs to be 0.25MM away from the objects in the board, the V-CUT position needs to be 0.3-0.5MM away from the objects in the board, the board thickness is 0.8MM and below 0.3MM, the board thickness is 0.8-1.0MM 0.35MM for plate thickness 1.0-1.6MM (including 1.6MM), 0.4 for plate thickness 1.6-2.0MM, 0.5MM for plate thickness 1.6-2.0MM. If the design data does not meet the above parameters, we need to dig out the copper according to the above parameters, and the finished product shall not expose copper. (If your company has special requirements and cannot remove copper and objects from the board, please note) |
| 16 | Jigsaw puzzle | For boards with process edges, our company will add 4 2.0MM NPTH positioning holes and 4 1.0MM MARK optical alignment points on the process edge if the process edge is assembled by ourselves. If the process edge is small, we will add the positioning holes Change it to 1.5MM. If it is shipped as a single board, our company will not add any light spots or positioning holes. |
| 17 | layer arrangement | In order to increase efficiency and avoid unnecessary EQ questions, please provide the layer order for multi-layer boards. We will give priority to the order requirements at the front desk. If there is no requirement, we will use the GERBER naming on the information. |
| 18 | Stackup and impedance confirmation | Unless your company specifically requests confirmation at the front desk, lamination will follow our company’s normal procedures. If the line width of the impedance board is adjusted to within 2MIL, we will directly control the impedance and put the laminated structure into production without going through cumbersome confirmations with your company (unless your company has special requirements) |
| 19 | design software | The filling copper method of PADS can only be the Hatch method. |
| 20 | If the incoming files include both PCB files and GERBER files, we will always use the GERBER files as the standard. If there are production files, we will use the production files as the standard. (If the production document does not indicate that it is a production document, we will treat it as the original design document for production). The above priorities are: production files → GERBER files → PCB packaging files | |
| 21 | Our company only supports PCB files designed by Protel series software, AD series software and PADS software, and there are many versions of AD software. If it is AD design, please send the GERBER file directly from your company, and we will transfer it according to your company’s request. data production. Because our company has hundreds of external order engineers, their software cannot be unified. Our company does not accept complaints about functional errors due to software version problems, nor will we bear any costs. | |
| 22 | shape | The edge pointed by the arrow is for the V-CUT process. However, because the middle of the board has been electrically milled, there is no stress point when the V-CUT knife passes through, and the finished product will produce slight burrs. In this way, the finished product will be obtained by your company. After the board is finished, burrs will appear on the edge of the separated board. Please accept the slight burrs caused by this phenomenon. |
| 23 | Order requirements (especially important) | The documents in the compressed package and the writing requirements in GERBER are considered invalid. Please describe the process requirements completely in the process remarks when placing the order. All other remarks are invalid. |
| 24 | Jigsaw puzzle | When we produce small boards, it is recommended to assemble the boards. As shown in the picture, the ultra-small boards must be assembled to be larger than 100MM on the side that is not in the V-CUT direction, otherwise our automatic V-CUT machine will not be able to pass it. If it is both in the X and Y directions, For V-CUT, the board size must be greater than 100*100MM. The above rules are only for ultra-small boards. |
| 25 | When designing the panel, if it is an ultra-small board, we will do it for you. The width in the direction that is not V-CUT must be greater than 100MM so that we can V-CUT accurately. If V-CUT is required in both directions, when the panel is assembled, , we need to piece it into a size larger than 100*100MM | |
| 26 | Design anomalies | In this design, if there are no connecting lines on the same network, or the same network is only connected by one wire (less than 4MIL connection bit), we cannot guarantee that it will be open and closed during the production process. Please specify it when designing the data. The wiring of the same network must be connected completely, so that each other has a quality guarantee |
| 27 | Puzzle shape | For boards with a similar shape, there will be a very small and long acute angle between the two boards after assembly. Where the opening width of the acute angle is less than 0.8MM, we cannot clean up the cloak in that distance, so we can only It can be processed according to the data. Please pay attention to this situation when designing the panel. |
| 28 | data conversion | For all files designed by PADS, we will redefine the layers and attributes internally. If you do not reset it, directly transferring out of GERBER will result in more or less data. For the sake of unification, we will redefine the layers and attributes according to internal technical requirements. If there is a conflict or difference with the original settings, Our company will not be responsible. Finally, I suggest PADS files. The safest way is for your company to provide GERBER files, which can better ensure the accuracy of file execution. |
| 29 | Plate thickness selection | Single-sided and double-sided documents, when your company orders a plate thickness of , because we need to select a production core board based on the same order board thickness. After the orders are combined, the order for this bare board will also be combined with other boards of the same thickness. The other boards will be copper-clad (the board thickness meets the standard). The board is not copper-clad (the board thickness may be thinner) |
| 30 | design | For the openings and slots of the outline layer, we only recognize the PCB file in GKO (no wiring layer) GM1 (mechanical layer 1). If there are other layers in the design that we need to do the outline, please make a note. |
| 31 | Design (square groove) | For those who have placed an order and require a square groove design, we will add at least 0.5MM corner holes in the four corners of the groove. When the groove width is large enough, we will usually add 0.8MM corner holes (R Angle is 0.4MM) If the width of the square groove is less than 1.2MM, our door will not clean the corners by default (the R angle will be in the range of 0.5-0.6MM). This design is a balanced production design, please understand |
| 32 | Design (Electric Gold Finger) | Fingers are divided into equal-length fingers (conventional) and long-short fingers (unconventional). If the edge of the finger is too far away from the edge of the board, the bevel cannot completely remove the finger lead. Therefore, by default, the fingers can be shipped with leads. If the customer does not want fingers with leads, it needs to be confirmed and remarked by our market reviewers. There must be no lead residue on the gold fingers. |
| plate | Kingboard/Guoji | Kingboard/Shengyi |
| mechanical drilling | PTH aperture tolerance ±0.075mm NPTH aperture tolerance +/-0.05mm Hole wall roughness ≤25μm | PTH aperture tolerance ±0.075mm NPTH aperture tolerance +/-0.05mm Hole wall roughness ≤20μm |
| line | Allows line patching, alignment accuracy +/-4MIL | No patching allowed, alignment accuracy +/-3MIL |
| plating | The average copper hole is 18μm, and the ductility of copper plating is ≥15% | The average copper hole is 25μm, and the ductility of copper plating is ≥20% |
| solder mask | Offset +/-3.0mi Guangxin ink, ink thickness 8μm | Offset +/-2.0mil Guangxin Ink/Sun Ink, ink thickness 10-15μm |
| Shape accuracy tolerance | ±0.13mm | ±0.10MM (±0.05mm laser cutting can be specified) |
| Surface finished copper thickness | 1oz≥32μm,2oz≥63μm,3oz≥98μm | 1oz≥35μm, 2oz≥70μm, 3oz≥105μm (can be specified up to ≤10oz) |
| Fire-proof level | UL safety regulations: 94V0 (After two 10-second burning tests were conducted on the sample, the flame went out within 10 seconds) | UL safety regulations: 94V0 (After two 10-second burning tests were conducted on the sample, the flame went out within 10 seconds) |
| Continuity test | Customized test rack test/100% flying probe full test | Customized test rack test/100% flying probe full test/four-wire low resistance flying test (Level III acceptance criteria can include this, but it does not have to be included) |
| Warpage | ≤0.75% | ≤0.5% |
| Package | Ordinary packaging/vacuum packaging+desiccant | Vacuum packaging + desiccant + humidity card + separator paper |
| shipment Report | shipment Report | Provided according to product design characteristics: shipping report, test report, impedance report, with impedance strip |
| physical experiments | Solderability: Wetted area is greater than 95%, plated through holes are completely wet Thermal shock reliability: 288+/-5°10 seconds 3 times | Solderability: Wetted area is greater than 95%, plated through holes are completely wet Thermal shock reliability: 288+/-5°10 seconds 3 times |
| Acceptance criteria options | IPC-A-600J II | IPC-A-600J III |
