Electronic product ODM, OEM
In the field of electronic product ODM and OEM, as a company with decades of rich experience in electronic manufacturing services, our accumulated R&D and PCBA processing and manufacturing capabilities make us competent for our customers’ electronic product ODM and OEM. tasks, give full play to technical and management service capabilities, and continue to create value for customers. After years of technology accumulation, based on experience in ARM, FPGA, CPLD, DSP, AVR, and PIC development, we provide you with complete ODM and OEM services.
Starting from the circuit board production process, we strictly follow your requirements, select high-quality boards and high-precision production equipment, and conduct 100% AOI, flying probe and test frame testing to ensure extremely high quality and throughput rate; in the component procurement process, We have long-term cooperative relationships with large-scale brand component agents, and have high-quality bulk purchase and bargaining power to ensure the quality of incoming components. In the SMT patch and DIP plug-in links, we use high-precision Fuji high-speed machines and 10 temperature zone reflow soldering , wave soldering to ensure the reliability and quality of welding. Throughout the entire manufacturing process, we have strict IQC incoming material inspection positions, IPQC process inspections and OQA factory inspections to ensure that problems are not passed to the next workstation. In addition, we will provide product assembly (Box Building) services based on customers’ product design plans, seamlessly assemble PCBA circuit boards with related molds and accessories, and conduct FCT functional testing to provide customers with complete ODM solutions.
OEM/ODM process capabilities
| Through hole board | HDI | FPC flexible circuit board | |||
| project | Process Capability | project | Process Capability | project | Process Capability |
| Maximum number of layers | 40L | Minimum line width/space | 0.05/0.05mm | Maximum board size | 2000*240 mm |
| Maximum plate thickness | 8.0mm | critical line/tolerance | 0.065/15% | Maximum number of layers | 10 |
| Minimum plate thickness | 0.4mm | Minimum blind hole diameter | 0.10mm | Minimum line width/line spacing (1/4OZ) | 0.04mm |
| Maximum thickness to diameter ratio | 14:01 | Blind hole accepts PAD size | 0.23mm | Minimum line width/line spacing (1/3OZ) | 0.05mm |
| Maximum copper thickness | 10OZ | PTH & blind hole size | 0.20mm | Minimum line width/line spacing (1/2OZ) | 0.055mm |
| Maximum working board size | 2000x610mm | PTH PAD size | 0.35mm | Minimum via | 0.15mm |
| The thinnest 4-layer board | 0.33mm | Blind hole thickness to diameter ratio | 1:01 | Minimum via pad | 0.25mm |
| Minimum mechanical hole/pad | 0.15/0.35mm | HDI order | 3+N+3 | Minimum laser hole | 0.10mm |
| Drilling accuracy | +/-0.025mm | The thinnest 8-layer board thickness | 0.8mm | Minimum Laser Hole Pad | 0.25mm |
| PTH aperture tolerance | +/-0.03m | Minimum pad single side opening window | 0.038mm | Cover film alignment tolerance | 0.15mm |
| Minimum line width/space | 0.065/0.065mm | Minimal green oil bridge | 0.065mm | Appearance tolerance | 0.05mm |
| surface treatment | ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag | Minimum CSP/BGA spacing | / | Minimum punch hole width | 0.60mm |
| Impedance control tolerance% | ± 5 | Pitch tolerance | ± 0.05mm | ||
| surface treatment | ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink | Combination of soft and hard (Yes/No) | Yes | ||
| Air Gap capability(Yes/No) | Yes | ||||
| surface treatment | ENIG/ OSP/ Au Plating (soft/hard) |
OEM/ODM quality control
1. The Quality Control Department organizes the unqualified or non-compliant responsible department or the defect discovery department to review the non-conforming organizations and establish a problem-solving group.
2. Analyze potential defects or non-conformities through the use of testing, simulation, data analysis, QC techniques and other tools, conduct appropriate error-proofing design and quality control, and propose preventive measures plans.
3. For the bad or non-conforming items that have occurred, the problem solving team will re-evaluate and approve the correction of relevant technologies, quality standards or improve the process or design level, etc., confirm whether all products or processes related to the quality system have similar problems and conduct a comprehensive Prevent and propose solutions.
OEM/ODM production cycle
For small batch OEM/ODM, it usually only takes 30 days. Rapid prototyping allows customers to see samples for the first time, shortening the time from product design to production. For PCB manufacturing production in different batches, the production cycle is different. Under standard PCB production conditions, the length of the production cycle is determined by the batch size.
