After electronic product engineers design PCB Layouts based on schematic diagrams, because they do not fully understand the PCB production process, some more complex PCB boards will have a higher defective rate due to design reasons. At this time, DFM inspection must be performed before PCB file delivery and production.
DFM inspection is an important part of the electronic manufacturing process
After receiving the customer’s PCB Gerber file, professional electronic engineers will conduct a DFM inspection, conduct professional analysis of the line width and spacing, aperture, board edge distance, window opening, solder mask layer, etc., promptly propose some improvement suggestions, and formulate DFM reports are submitted to clients and this work is provided free of charge. After the customer receives the DFM report, the design engineer will make some simple PCB design adjustments to achieve a balance between functionality and perfect manufacturing.
DFM inspection capabilities
1. Number of PCB layers: up to 12 layers
2. Support special process requirements such as HDI, blind and buried vias, and impedance.
3. Professional DFM inspection software, comprehensive system inspection item by item
4 Prepare professional DFM reports
DFM quality control
1. Communicate with PCB production engineers on complex issues to confirm the unity of engineering processes and PCB design documents
2. Conduct in-depth communication on process requirements with customer design engineers before DFM inspection to fully understand the market positioning of PCB products
3. For defects or non-conformities that have occurred, engineers will re-evaluate and approve relevant design corrections and provide suggestions.
DFM inspection cycle
For small batch DFM inspection, it usually only takes 7 days. Rapid proofing allows customers to see samples for the first time, shortening the time from product design to production. For DFM inspection of different batches, the production cycle is different. Under standard conditions, the length of the cycle is determined by the batch size.
